Flexible Printed Circuit Board commonly known as flex PCBs are a revolutionary step in modern electronics that offer compact, lightweight, dynamic and precise designs. flex PCBs are designed to bend, twist and fold which rigid boards are incapable of. These characteristics have led to their widespread adoption in industries like wearable technology to consumer electronics to aerospace and medical technologies.

With demands increasing day by day for miniaturized and ergonomic product designs, understanding the process of a flex PCB from its prototyping phase to mass production has become a must. In this article the journey of a flex PCB from prototype to mass production will be covered.

Application of Flex PCBs:

The rise of flex PCBs is because of their versatility. They're mostly used in -

● Medical Devices: Pacemaker, Cochlear implants and Wearable diagnostics.

● Consumer Electronics: Smartphones, Foldable Screens and Fitness bands and so on.

● Automotive Systems : Airbag Controllers, Dashboard interfaces and sensors.

● Aerospace and Defense: Satellite, Avionics and high reliability communication systems.

Manufacturing Steps Of Flex PCBs :  

Flex PCB manufacturing is almost similar to the traditional PCB manufacturing process but here the use of specialized materials and procedures are needed to ensure flexibility, durability and quality control. Here are the steps to do this right-

1. Material Selection:  The most suitable base substrate is Polyimide. It is chosen because of its top notch thermal stability and amazing flexibility. It  is actually a copped-clad on one or both sides depending on needs.

2. Cleaning and Preparation : The copper-clad polyimide is thoroughly cleaned to remove oxidation and contaminants before proceeding to the  next step.

3. Photo Imaging and Patterning : The Copper surface is laminated with a Photoresist . A UV light source projects the circuit pattern into a photomask which hardens the exposed areas.

4. Tool : The unwanted copper is etched and unexposed photoresist is washed away which leaves only the wanted circuit traces.

5. Drilling and Plating : In multilayer designs precise drilling is performed then the vias are plated with copper to create electrical connection between layers.

6. Coverlay Application : Here a coverlay made of Polyimide and adhesive is applied to protect the circuit. It's laminated and cured to bond securely with substrate.

7. Surface Finish:  Immersion Silver or OSP or ENIG surface finish is applied to prepare the pads for soldering this also protects the exposed copper from oxidation.

8. Laser or Die Cutting : The board outline is cut using laser for precision.

9. Electrical Testing : Automated test equipment ensures that all traces and vias are correctly placed and checks for violations.

10. Inspection and Quality Control : The board now undergoes flex testing and visual inspection according to industry standards.

Detailed Manufacturing Process

The first thing we do is to cut the required material off a roll into big enough sized panels to process.It is a double sided copper with polyimide in the middle. The next phase involves drilling holes in the board in the panels we cut earlier. There are computer controlled drilling machines that work in unison on the same set of panels for identical tasks. The drills located in the front section of the drilling machine can automatically change their bits as needed. The panels we extracted from raw material sit beneath a fiberglass board that holds them firmly in place ensuring they remain flat for accurate processing.These machines have really high RPM because the bits are so small they need high speed in order to operate. Then the holes are placed on the panel.

The next step is to electroplate the holes we just drilled so the holes stay connected with both layers. Instead of doing it automatically the factories prefer doing it manually getting better results because it's more controllable this way. The next step is to apply photoresist on the boards. The photoresist hardens when they're hit with UV light. This process leaves copper only where we want it. The panels are then heated and pressed. The machine digitally exposes the design. So now we have a photoresist sandwich with copper in the middle and there is a clear plastic material that protects the photoresist material. This is the most important step because in this step the copper is placed.

The next step is acid etching. In this step all of the non exposed photoresist is going to be removed. Then the unwanted copper is gonna be etched away with acid. And we're left with dark photoresist and clear exposed copper. Now that the unwanted copper is etched off, we can see the clear polyimide and the blue photoresist that's still on the copper.

The next step is to remove the photoresist which is what we call stripping. Now we're left with a bare copper circuit board. Now we do soft etching to remove the oxide layer.

And the next step is to wash and dry the board. Now we apply coverlay which is the equivalent of a solder mask on rigid PCBs.

And the next step is to heat press the coverlay to laminate the whole thing to the board.

Now we do gold plating on the PCB board to prevent any oxidation and corrosion. Now we apply the silk screen onto the board. The next and last step is to cut the board out of the panel using a UV laser. Now the manufacturing part is complete and we do the quality check if it checks out we’re good.  

Inside a Flexible PCB Factory

Transition to Mass Production :

Once the prototypes are done and pass all performance and durability tests the product then goes into mass production.

Steps in Mass Production :

1. Design Freeze: Lock in all specifics after rigorous testing and stakeholder approval.

2. Tooling Setup: Create precise stencils for high speed fabrication and assembly.

3. Process Optimization: Fine tune lamination, drilling and plating processes for volume efficiency.

4. Quality Control Scaling: Implement in line testing and automated visual inspection.

5. Planning: Coordinate supply of polyimide, adhesive and finishes.

Conclusion :

Flex PCBs are an indispensable part of modern electronics enabling innovation across diverse sectors. Their ability to combine flexibility, durability and compact design unlocks new possibilities for product engineers and system designers.

From the initial stages of design and prototyping to the demands of high volume manufacturing each step of the flex PCB process requires precision, expertise and careful coordination. By understanding the intricacies of the flex PCB manufacturing process, organizations can harness the full potential of this powerful technology and bring next generation products to life faster, smaller and smarter than ever before.